New VirEnce MCPCB for E17/E21/119/144/233U

0.5mm thick copper tracing??

OMD, I wish… :smiley:
No, it’s the thermal pads to insulate the MCPCB from the base

Ah, completely mistunderstood it then, or it was wishful thinking :slight_smile:

FYI,the next VirEnce will be 3 oz thick minimum.

I’m an SI person, had to look that up: 3 oz = 0.1mm sounds good :slight_smile:
I could not find back what the copper thickness of my 119 boards are, but a common thickness for Kerui seems 0.036mm, that makes your tracing 3 times as thick.

I’m an SI person too. It’s just Oz is a universal unit used in many copper tracing industries. Yes, It was hard to convince them to make 3 oz for me. I had to insist on it (at additional charge). I haven’t place the order yet, even though I made them busy for weeks :smiley:
They have one of the best customer service in the industry.

Great, thanks!
When will you get samples of the PCBs?

Later when the high season ended I guess. Too many unexpected expenses for now :wink:

The samples just arrived


Features:

  • PEEK screw: continuously usable up to 248C (480F). Resist most chemicals (highly resistant to salt, acid, and alkali)
    Datasheet: PEEK screws

- Thermal pad: thermal conductivity12 W/M.K; thermal resistance 0,12 C/W; electrically insulator; compressible down to 30% (0,5mm down to 0,15mm)
Datasheet: TG-X

Estimated price

- 21mm x 0,5mm thermal pad: USD 5 - 5,2/pc

- 17mm x 0,5mm thermal pad: USD 3,7 - 3,9/pc

  • M3 x 0,5 x 8 PEEK screw: USD 2,8-3/pc

- Clemence

Any updates?

Not yet. This is harder than I though. But there’s a good progress going on

Thanks, Clemence. My 144a build is all ready to go minus the board. Hoping that everything will go smoothly and they will be available by the end of February/early March.

Update 170208:

Change of plan: the design will be completely different. No thermal pad required to make things simpler. I’ll get back to here when it’s done.
Really working hard on it! Stay tune

Any updates Clemence?

Copper version: Highly dependent on premium good thermal pad, complicated or limited design by nature. Pricey end product complete package and the least application friendly. Especially for us who often change the LED. For plug and forget it’s relatively OK, but not so much.

Aluminum nitride version: Simplest higher performance potential, yet brittle and still pricey [on my ends]. Still looking the best vendor and material combinations.

Aluminum nano ceramic [dielectric] version: cheapest so far, but I really don’t like the idea of using aluminum substrate when I know there are many superior options out there.

Still on it….

- Clemence

Thanks for the update.

Just stumbled around here to briefly check this out…

Heard good things about the aluminium nano dielectric stuff in the past, to the point of ordering a “nano” MCPCB from FastTech, though MessTech ended up sending me a copper DTP board instead (which was marked as “discontinued” on their site… :facepalm: ). Didn't complained.

Cheers fellows ^:)

Basically it’s just a nano meter thick anodizing/passivation method to create a non electrically conductive surface. What’s so special are the processes to make extremely thin passivated layer and make it solderable. Even though the thermal conductivity is just ~7 W/M.K, the thermal resistance (which really matters) is extremely low due to the super thin dielectric material created.
For low power this technology is superior (cheap, reliable, effective) but for our purposes it’s not the case. We still need same or better material like copper to spread the heat faster.
I read your post somewhere in CPF about this MCPCB. The use of word “Nano” (which already over used as marketing gimmick booster by many chinese products) really turned down people :laughing:
They didn’t even bother to further learn about it. But, I read it Bark :wink:

Any updates?

Is the footprint on this board what I need for this LED?
http://www.leds.de/en/High-Power-LEDs/Nichia-High-Power-LEDs/Nichia-SMD-LED-UV-NVSU233A-without-PCB-emitter-395nm.html