basically why I was not happy with poor cooling of the boost chip with no viases to the other layers and the option to put more boards on a Seeed 10x10 board in production
and I got no Eagle, no advanced license for it and I think getting used to a 2. program is too much
I did some light load bench tests, before I fried my driver. The most I did was 8W for 15min in free air, with an XHP35.
No problem for the driver at all. The XHP35 was a few centimeters next to the driver, and was shining on it a bit (when I blocked the light shining on the driver with my hand, it got pretty warm). Even with that, the driver got just a bit warm. If I had to guess, it was around 40°C (with 24°C ambient).
The board that I used was the first revision and had bad thermal properties. The newer boards should do better.
There are multiple values given in the table with various resistor values, but when you scroll down to the graphs, there are two called:
OUTPUT-VOLTAGE SWING HIGH vs. TEMPERATURE
OUTPUT-VOLTAGE SWING LOW vs. TEMPERATURE
Now these values from the graphs are much lower than those from the table. For the “table values”, there is a resistor RL connected to the OpAmp, but I don’t know how it is connected.
Is RL connected between the output and VDD/2, to show how near the OpAmp can get to the rail with a load on it, and the graphs, when there’s no load?