Oh you’re right, I wonder why the CELNM1 has a higher stock output then, if it’s basically the same die.
The CELNM does have higher thermalresistance due to the smaller pad, but what’s cool is that the CSLNM actually has less thermal resistance than the black flat.
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For the CSLPM1 even though it has a smaller thermal pad it is still the same size as the CSLNM1 and has the same thermal resistance as the Q8WP, so it might not be that difficult to cool well.
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So in summary:
LUW HWQP: White 3.05 W 325 lm 108 cd 1000 mW 334 mW/sr 120° = reference
KW CSLNM1.TG: White 3.00 W 325 lm 108 cd 1000 mW 334 mW/sr 120° = same contact pad size, lower thermal resistance
KW CELNM1.TG: White 3.00 W 374 lm 124 cd 1150 mW 384 mW/sr 120° = small contact pad, higher thermal resistance, for some reason better performance at stock? will not work on any normal MCPCB
LE UW Q8WP: White 4.20 W 533 lm 153 cd 1650 mW 473 mW/sr 130° = large contact pad, lower thermal resistance than black flat
(die size 1.91mm^2)
KW CSLPM1.TG: White 4.20 W 515 lm 171 cd 1590 mW 529 mW/sr 120° = same contact pad size as black flat, same/slightly lower thermal resistance as Q8WP (much lower than black flat)
(die size: 1.99mm^2)