Osram Oslon Boost HX

The point here is that you can use my conversion factors to calculate the luminance of these LEDs ( I also posted numbers in the other Ostam “white” thread) based on the lumens they put out. Just multiply the two values. You have already measured the lumens at different currents. Now we can calculate the performance of different lights using these LEDs.

There has always been a slight discrepancy between the measured values and using the lumens/(area*pi) formula.

Further notes:

  1. I see that The Diver listed the die size as just 1.25*1.59 rectangle. This is marginally untrue because of rounded edges.
    If I calculate size from 0.167 cd/mm²/lm I get 1.906047 mm². 4.1% less? Rounding seems smaller than that, so we have some discrepancy, but marginally smaller than before.
  2. From the application note:
    “additional care should be taken to minimize mechanical stress on the silicone encapsulation”. Silicone? I thought they use sintered phosphors. Does that include silicone? Or did they just copy and paste this sentence from another document?

If Boost HX actually becomes available reasonably soon and performs in line with the expectations, it’s going to give LEPs a run for their money.

It’s not as intense, but close enough to compete with the current generation of LEP flashlights. Output is way higher. Efficacy is good. Price…way way lower.

I’m not sure regarding that. Maybe they put silicone on top of the sintered phosphor.

^ Just like XP-L HI and XHP35 HI

Well yes and know. Those LEDs also have silicone inside the phosphor and it’s not sintered (Cree has never mentioned this as far as I know). I mentioned the article regarding sintered phosphor here.

This might refer to the white stuff surrounding the die. Could be a rigid silicone with fillers.

That stuff on the PM1 is not silicone-like but seemingly rigid stuff that chips off.

djozz knows, he is a serial LED abuser.

Maybe ceramic?
Stable at high temps…
Or that white cement stuff put on high temperature bulbs:

I’m pretty sure it’s not a premolded part since it encapsulates the bond wires (see the OSRAM document somewhere above). It’s very likely molded around the mounted die.

They talk about the types of materials used here: Link

I know it’s not very “silicone-like” but that’s based on the “typical” silicones we know. Even cheap Fujik is quite different (hard and almost brittle).

The white stuff shows no flexibility at all, it breaks, and makes a scratching noise when I rub it with my forceps. It has at least the hardness of bakelite, or maybe it is ceramic.

I know, the CSLNM1 I have here are packaged in the same stuff. Again, I see no reason why this couldn’t be a filled silicone compound. It behaves like one under the tip of a soldering iron too (gets crumbly around 300°C, never melts). And the advantages in this application are obvious.

How could they cast ceramic around the die + phosphor + bond wires (nicely visible in your pic btw)? They clearly mold this in place.

Aaaaanyway… my point was that there’s fragile bond wires embedded in there and that may be why they mention not to put pressure on it.

I don’t know enough about ceramics to know that it can not be casted in this way, so I’m with you in this :slight_smile:

Asbestos :smiley:

It would have to be fired at 1000° upwards.
But it might be used here as a filler material (it’s stiff, opaque and doesn’t degrade or outgas :+1: ).

There are ceramic adhesives which are used in bulbs because of low thermal expansion at high temperatures.
Just because it is “ceramic” does not mean it is solid like a rock.
It can be made into epoxies or other stuff.

Interesting. Ceramic powder with some sort of silicate binder.

Any updates on this?

Not available yet.
https://octopart.com/search?q=KW%20CULPM1.TG&start=0