The full mechanical specifications can be found in the original post, but the height is 15.4mm. I always assume a little slop due to manufacturing tolerances and leave 16mm of clearance.
PPtk
Edit: Without optics, the tallest thing on the circuit board is the Inductor. Without optic the total height is 0.4mm (circuit board) + 5mm (Inductor) = 5.4mm.
The XM-L emitters are 3.02mm tall, so the height of the emitters is 0.4mm + 3.02mm = 3.42mm
Those numbers are a LITTLE low since there is some solder between the inductor/emitters and the circuit board, but at most the solder accounts for an additional 0.127mm (5 mil solder stencil).
For those who are intending on purchasing a DIY Kit, here is the assembly drawing - shows which part goes where. All of this information is on the Silk-Screen of the board, but I find it much easier to build when I can look at a reference (and possibly even make notes on it).
Gold plating for solder pads can be a bad thing! Gold tends to form intermetallic compounds with lead/tin/aluminum (google "purple plague" for a well known example). These can be brittle and poorly conductive. Components have been known to fall of circuit boards...
looking great Pilot, can't wait to see these in action.
About the programming - can the controller chips be supplied programmed off the board for self-assemblers or can they only be programmed after assembly using the pads on the board?
U2 Cool is going to be a bit brighter than a Neutral, but we are talking about 3 FULLY driven XM-L's. It's a lot of light no matter which exact emitter you choose.
The ENIG (Electroless Nickel, Immersion Gold) process has been perfected over the years, and solder joint quality on ENIG is excellent. "Purple Plague" is really a reference to brittle joints between aluminum and gold and is seen when gold is used inside of a chip package where a wire-bond takes place. Wire bonding and soldering are very different processes. "Black-Pad" can be a problem if electro-plated Nickel is used as the base, but circuit board finishes use electroless nickel to avoid that problem. Even NASA and the U.S. Military approve of the use of ENIG PCBs - And I promise that neither of those agencies would tolerate random components falling off of their assemblies. Components won't be falling off of these boards.
Purple plague is the aluminum-gold intermetallic. It is the most common/notorious. There are also gold-lead and and gold-tin intermetallics.
See the wikipedia article on gold plating. last section on soldering issues:
You are probably better off masking the gold from the component pads. There are also some indications that, under the right conditions, gold may help catalyze the formation of tin whiskers from lead-free solder. And gold can grow its own whiskers. But it sure is pretty...