Ok, let’s return to serious side, sorry for my clownery
comfychair, first copper direct connect I’ve try was SinkPad and second Noctigon
I have some censorious remarks for both
I don’t base on somebodies pictures or judgment – it’s my own experience
All sinkpad have problems with design: very thin power paths plus no way out for solder from thermal-pad
Some noctigons (I’ve bought it from IO) have problems with gap between thermal-pad and power-pads layers and some others have a problem with positioning
Pictures above-n-below (it’s my picture and these boards was bought from IO) shown it
I’m understand baffling complexity of producing copper MCPCB
And now I’ll try to produce some better product, no more
Thanks for making these boards and posting here, your boards really look nice, and thanks for explaining how they will be better than Sinkpads or Noctigons. I (and others) have not found a significant lack of performance with either Sinkpads or Noctigons (it may just be ignorance ;-) ), but I guess that if you measure well you could see a benefit from the thermal pad and connecting pads being exactly level.
I'm not a large-scale consumer, but I'm in for three triple boards and two quad boards, if only for the very elegant design :-)
I actually have a few of the Carclo quads so this is interesting. They are even more floody than triples however. Khatod makes a 20mm quad that has deeper optics but the peg footprint doesn’t match the Carclo quad(pegs closer to edge on Khatod). To work with both optics the peg holes would need to be elongated radially.
-Edit
My bad, those are 25.4mm optics but I believe the led footprint is the same as on the 20mm Carclo, the extra 5.4 mm allows for the deeper optics. Still, a board that works for both would be nice. Probably too late though.
Here is how those boards with the depression/gap thermal pad perform.
Note: Ambient temperature is slightly higher on the Noctigon XM20 testing, which should give Sinkpad a leg up! Solder alloy is identical in all tests.
What is not mentioned here is that none of the 3XP have a depression/gap at all on the thermal pad, in the single batch we did so far for those.
Important is that not all boards have that depression for the thermal pad is only a certain batch, again the one in the test is one of those, mistakes happen and flaws appear, we are not claiming flawless here.
In this case of the thermal-pad depression/gap boards batch, there is no thermal issue due to the slight depression as the seller implies as the test shows it.
that is a nice test Hank! It indicates how well the direct bond to copper of the thermal pad actually performs. I am sure that a gap filled with solder does have some influence on those temperatures, but doubt that the influence will be more than 1 or a few degC.
Still, for the hardcore snobs, even if you proof that the difference is negligible, no gap will always be more desirable than a gap