Oshpark Projects

Did you post your DXF/whatever somewhere? A straightforward conversion would be to export bitmaps and then use Eagle or KiCad to import the bitmaps into layers. From there you can export a set of gerbers.

This process can generate rough edges. In the past for my own purposes I’ve exported high resolution bitmaps at 4x my desired size. I would then import them into KiCad and save that. At that point I’d use a web service to reduce them to 25%. (the web service is intended to help fix stuff like putting logos on silkscreen art). Once they were reduced they were the correct size of course and I’d reopen the files in KiCad and export gerbers. It’s a lengthy process because you must do it for every layer. Good luck!

I got a batch of boards with empty ring on the edge, but i thought it was a fault because the LED+ was not exposed and in the second batch were copper to the edge.

Seeing the second board i didn’t know why OSHpark recommends at least 15 mil (0.4mm) clearances from traces to the edge of the board, but now i know there are variation between different fabs, it makes sense .

Great tip, i’ll put into practice.

Yeah, that kind of change is a bummer. I have about 500 17mm boards with no exposed copper behind the FET. Same exact file I had already ordered dozens of times, but the time I went to order the most look what happened!

If you look at the silkscreen and milling/drill hits you can often tell which Oshpark fab they were from. I can distinctly tell the differences between them, but you never know which one you're going to get.

It has been a lot of time since i posted v004 (I have been a bit busy due to exams), but today i’ve finished a new version.

Theese are the changes from v004:
–0603 diode pads (for zener mod)
-More exposed copper on top GND ring
-Added copper pour under MCU for temp sensoring
-Wider bottom GND ring near FET vias

https://oshpark.com/shared_projects/tjm3DzQH

As always, any suggestion will be welcome.

Nice, one question is it “only” a design change to wights A17DD-L or is there any extra functionality?

Is it possible to drill through that LED+ pad and push a cable through? Could you already make a hole there? This way you can use the same cable to bypass the spring and to get to the LED.

Hi finges,

there is an extra funcionaltiy, pads for a pull down resistor (PDR) to avoid "turbo to moon" blink.

I doubt a hole could be drilled, but i can make it in the design.

Stay tuned.

This version has been replaced by v006: Oshpark Projects - #1686 by Pablo_E

Done!

Hole (actually is a via) is 2mm/0.0787inch in diameter.

https://oshpark.com/shared_projects/rVrw8a4J

Very nice Pablo! Thank you very much for sharing. Only thing I’d like to see changed is the 0603 cap, I would prefer 0805 for an OTC.

+1
I think if you moved the FET pull-down resistor to right above the FET, you would have room for 0805 pads right at the top of the board.

Or rotate R1 90 degrees, then you can fit all three resistors side by side closer to the center, leaving plenty of room for a 0805 OTC pad.
But myself, I wouldn’t bother. I use 0603 on all my boards.

Don’t you consider soldering a 0805 cap on the 0603 pads?, I don´t know how difficult it is, but it fits (like in the right diagram)

Do you prefer the 0805 option?, if so it could be done performing both of your suggestion, i see some potential clearance problems but i think they could be solved.

Yet another untested monstrosity… This implements what is intended to be a snubber for 1s applications, plus a bleeder for pilotdog68’s tailcap LED system, plus an OTC pulldown, plus a gate pulldown, plus a 3mm via for the BAT+ wire. There was no space for a BAT+ pad on top, so it’s bypass or go home. At first I thought that I was going to be forced to increase my normal 1mm physical keepout, but somehow I got away with it.

This version has been replaced by v007: Oshpark Projects - #1686 by Pablo_E

This board is really dense populated! you made a great job!

I have already changed OTC pads size to 0805, i have had to remove some vias, and voltage resistors may not be easy accesible, placed that way between tall components, but i think it is done.

https://oshpark.com/shared_projects/0NAo2EmQ

Thanks. :slight_smile:

Your board is clearly improving, but here are a few things (in no particular order):

  • Your silk lines are way too thin to be produced as specified. OSH Park or the fab will automatically thicken them for you, but I prefer to thicken them myself (for full control). The worst offender is the marking “PDR” - I suspect that this may not be legible after thickening. I don’t remember how thin OSH Park goes and I can’t find it on the specs page right now: OSH Park Docs ~ Services ~ 2 Layer Prototype Service Maybe someone else can help. Maybe I normally use approximately 6mil minimum? I’m not certain at the moment.
  • I still don’t think that the board is setup well for a Zener mod. If you’re still not clear on the Zener circuit maybe someone will throw up a quick diagram at some point. Clearly Zener compatibility is not required - it’s just something to think about.
  • R2 looks suspiciously close to the MCU for a stock programming clip to fit. R1 is definitely OK, the clip doesn’t extend into that area.
  • Version numbering seemed to stop at v5 where the the driver’s “H1” designation just started getting extra letters added to it? I suppose that’s related to the bypass hole.

Thank you too! it is improving thanks to all of your help.

I going to reply in the same order:

  • I didn’t know, i’ve took a look at a v003 I ordered to see how things were goin, and yes, silkscreen lines are thickened, but there is no small markings to check legibility :-/
  • Darn! i thought i got it, thanks for pointing it out.
    Sure it is not a mandatary, i will see what i can do, but if it is not done like i thought, i am affraid it wont be possible.
  • Well, my clip is not wider than MCU, but now i see the other clip version on google, seems that it could suffer this problem.

  • Yes, it is related to the bypass hole and the bigger cap.
    I have no clear how to mark them, as a new version or as a different branches.
    I dont want people to think newer boards are better, when they are only different, but i am not happy neither with the extra letters, i think i am going to back to numbers as it keep things simpler.

where did you get your clip Pablo?

Is a chinese no branded one you can find on ebay, aliexpress and many other sites.

I got it from this seller: Henny Liu’s store , but i don’t recommend him/her as i got different clip from which is shown on advert images, so random version could be sent.

Here is a pic of the clip i have:

After a long exams season, i have found some time to work with eagle.

I have tweaked my two last designs, so people who want to stay with 0603 OTC could use v006.

Changes are:

- silk lines are now thicker

- R2 is not next to MCU legs

- versioning is again with numbers only.

  • on v007 bypass hole is 2.2mm / 0.0866inch

I hope they are close to final design :smiley:

v006
https://oshpark.com/shared_projects/k6r3GbdV

v007
https://oshpark.com/shared_projects/z3TrmkmR

The D01 contact board fell of the list and I have sold all of my spares… May be some small demand for it…

Courui D01 Contact Board V3

I need some help. So far everything I’ve done has had a perfectly circular milling layer. How do I do other shapes accurately? Like an SRK driver with the tabs, or a tailboard in the SRK “flower” shape or for a ZY-T08?