Last time i used a pan but it took too long to reflows. So this time i just slowly incrase the power of the hot plate. But the problem is it took too long for the hot plate to cool down, i dont want to take the pcb out after reflows occurs because i want to place the pill on the leds while the solder still melting.
I didn’t use any solder or thermal past between pill and pcb, just used pressure from optic legs, do you think this would cause the leds to overheat?
Also do you think that the convoy s2+ with copper pill or the p60 with copper pill would be better at heat transfer? Thanks