I am now regularly using a small home-made hotplate for reflowing emitter onto boards (a block aluminium coupled to a power-adjustable solder iron) and what surprises me is how fast the board heats up. The block is not too much hotter than the melting temperature of solder, its surface has been sanded flat but not polished or anything, I sand the board flat before the reflow but only with 800 sanding paper, nothing near shiny. And no heatsink paste there. Still the solder melts in 10 seconds after I place the board on the heating block, watch this:
Or am I just thinking that 10 seconds to heat up the board from room temp. to 180 deg C. is fast, while it actually isn't fast enough for led heatsinking?
(on a side note: because there are those small extra wire solder pads near the emitter pads on the BLF 16mm Sinkpads, a XM-L led sometimes floats to the side onto one of them wire pads as can be seen on the video. Nothing that can't be solved with a small touch with the tweezers, but still a bit annoying)