KnHawke
(KnHawke)
50
Just need to toss in my two cents in this:
With the stencils, the one supplier my company works with can go as thin as 4 mils (maybe more, we haven’t checked), standard is 5.
If there is too much solder paste still occurring, the best way to counter is the design of the stencil cutouts themselves. For example, the DTP pad in the center of most High Powered LEDs, instead of one large cutout for it, seen pads like that with about 6 partial cutouts for example. So when the solder is flowed through the Oven, it spreads and pulls the component down. Same should be applied to the adjoining electrical contact pads so there will be minimal bubbling in between the surfaces (You can only truly seen them via an X-Ray device)
Another way that I have seen done is, with an SOIC8 for example, is to have cutouts on either end of where the component foot lands, allowing solder to flow up the leg and over the foot.
and lastly:
For the love of god…. DO NOT use an alcohol to thin out or re-wet the paste itself, it will cause the exact opposite of what you are trying to achieve!
If you need to, just use Paste Flux, a off-white fluid type. The pure liquid type evaporates way too fast to be of much use after it is mixed in.
(BTW, we use ALOT of Alpha Solder Paste every day, and we sometimes use the Paste Flux to thin the mix or just reflow parts that are too much of a pain to put back in my hand, like QFP144s, QFNs or BGAs)
Like what WTF has said, ya need to repack it from WinRAR format to WinZIP.
As to editing the files, you need a Gerber Editor. I have not looked for those but they may cost you for a decent one, but you can find viewers all over the place.