Thanks for the datasheets, Simon! I was about to ask if you could share them again since the previous hosting links are dead. Been very curious about the SFT40.
I really enjoy the balance between flood and throw in SST40. I guess SFT40 will be a bit floodier than CULPM1, but I wish someone post a beamshot comparison.
Looks like the SFT40 has 4 bond wires. Not sure I’ve seen that before; a bond wire at each corner of the die. If that is the case that should mitigate the burning bond wires failure mechanism of the SST40.
I don’t know, maybe later versions are tougher. Even when they did fail by burned bond wires it was at >8.5A, so it was usually not a problem, but it will still be nice not to worry about that failure mechanism.
I just ordered mine and don't have any on hand, so I can't say for 100% positive. However, the pdf datasheet shows the die size as a 5050 which is the same as Cree XML.