I remembered the bezel was glued and I’d yet to open the bezel-end of the head. So, I did a bit of research, having remembered seeing someone at least open the MF02. It turns out it was Lexel, and he mentioned here :
So, having a lot of experience opening glued phones/tablets in a previous employment (a few jobs ago, now), I knew what to do: I set the hotplate to 85C (allowing for some losses) and set the head of the MF02 upon it, bezel-down. Now, I don’t have the custom-cut wood piece Lexel used (I remember the old picture, it was basically a wrench and the “cut” was a fit to the bezel), but I do have some strap wrenches. I got the thing to 85 and let it sit for a while, until the top (which was actually the body-end of the head) was hot to the touch. Despite my best efforts I couldn’t crack it, so I tried again and turned the hotplate up to 90C. This time it worked! The goo gave way and I’m in.
I also assembled the new 4P cell carrier, and double-checked that everything tests correctly with my DMM. All good there.
It’s also quite late so I’m turning in for the night. Pictures tomorrow.
Also, I anticipate having four extra pairs of cell-carrier boards. That’s enough for four MF02 conversions or two GT->GT90 conversions. If anyone wants them, they will be available for the price of shipping.