I think this is the thread where I first learned about the 7135’s thermal fold back feature. Since then, I have witnessed it several times. I think I had a data sheet that had some info on it, but I lost a bunch of files a ways back.
Regarding your first question above. I’m guessing 5 chips at 100% duty cycle will get very hot if there is a big difference between Battery voltage and emitter Vf. Where as, 9 chips at 65% duty cycle will be much cooler. Just a guess.
Regarding the second question: The single 7135 can dissipate its heat directly into the driver and host. It is probably mounted on the ground ring of the driver which makes direct contact with the host.