I already have the C8TT head, got it for this project. It’s better because the fins allow it to cool off much faster. This way I can use the turbo mode more often.
BTW: I just noticed that at 30A the tailcap could get warm from the FET? At 3.5-4W loss in the FET-switch it should warm up noticeably after using Turbo for a few times.
I also still need to account for the heat dependancy of Vf of the LEDs.
EDIT:
If it lowers by 0.1V I get an extra 3.3mOhm of possible resistance.
At 24Amps I didn't notice tailcap heating,but whole host get hot,so it's hard to tell. Battery tube act as a heatsink, so tailcap overheating is not really possible.
Turn-on OTF lumens for 6x Luxeon Vs in C8 host at 30Amps should be more like 9000lm.
Now I am sure, that 9A would be clearly over both host and driver limits. I just would like to ask, that would I be safe with 6A as max. current in Jaxman E2L host?
I don't know what do you mean by "safe", it could be safe to use that host at any current, only difference is lumen output and time until host reach temperature that will trigger OTP protection.
E2L is an awesome host and spreads heat throughout entire body (good) but its only a matter of time before it steps down. I have all 3 leds u mention with FET driver in E2L and 1 S2+ XP-L HI with Cu pill and LD-B4 and mosx+FET. They are all really nice.
I plan to have the XP-L HI exchanged by the OBF in the BLF GT Mini but I'm not sure how sensitive this LED is when doing the reflow by oneself. Is there already any valid information when the successor of the OBF will be available?
I meant it regarding the driver plate. But as the head of a 8×7135 Convoy S2+ can reach temp easily above 70-75°C in still room temp air in less than 15 minutes, probably 6A with the E2L host will mean only about 3-4 minutes ‘turbo’ usage before driver protection shutdown mechanism at 105°C will kick in.
LD-A4 can handle 6-9A in triple setups,but only with good thermal path between driver's FET surface and flashlight body, something like S2+ thermal enhancement kit from my store would be required.
LD-B4 doesn't have these problems, but mosX boards must be used, and problem with JAXMAN host is that it uses non-standard ~19mm PCB diameter, with max. allowable diameter of ~19.5mm, at least that is what I've heard. Maybe new version of hosts allow 20mm pcbs?
Usually you can sand down pcbs by 0.5-1mm, but with mosX is there is high chance of short between copper top layer and core.