The rest of the new orders will be shipped tomorrow.
I’m also in the plan of making a 3rd gen spring with one very nice differentiation.
Basically, we will be using multi-layer plating!
It will be a nickel-copper-nickel plating.
Just to make sure people aren’t worried, this isn’t an downgrade from the silver plating.
In fact, it’s an upgrade.
That is because the TOTAL layer thickness of the silver is around 17-20um as I wanted it to be. I could have gone thicker at 20um+ as initially specified or even higher as Pirx, but the cost per spring became a bit prohibitive. So that change was mostly done for lower contact resistance along with slightly higher conductivity.
However, with a nickel-copper-nickle plating, it can be changed quite easily.
With a total layer thickness of 50um(25um per side, which is easily doable since we can use the whole surface area of the spring wire), we could get a massive, relatively to the nickel and silver plating, performance boost.
It would be akin to adding 0,130mm of thickness to the existing 1,0mm BeCu wire, but without the thickness impacting full compression height.
We would be gaining a 27% gain in terms of conductivity.
I am also going back to the old design, with only a tweak to the top diameter to get more conical compression.
Otherwise, that would mean we would go from an approximate resistance of 9mOhms down to an impressive 7,1mOhms.
Other than that, I have some other good news, but I’ll be writing about it later on.